Shanghai, China – August 1, 2019 – TE Connectivity (TE), a global leader in innovative connectivity solutions for high-speed computing and network applications, today announced the launch of its new Sliver jumper connector. Featuring a new standardized form factor, this connector supports panel-pluggable capabilities for the Open Compute Project (OCP) NIC 3.0 specification. The latest addition to TE’s Sliver product family is designed for compact OCP NIC 3.0 cards, enabling easier system maintenance while improving thermal performanceThe SFF-TA-1002-compliant Sliver jumper connector supports PCIe Gen 5 high-speed data transmission and is scalable up to 112G PAM-4. The SFF-TA-1002 standard is positioned as a potential successor to multiple existing specifications such as M.2, U.2, and PCIe. With a high-density design and 0.6mm pitch, the Sliver jumper connector addresses the channel count requirements of next-generation silicon technologies for PCIe standards, whereas existing products in the market have reached their channel limit.

The horizontal panel-pluggable design of OCP NIC 3.0 cards enhances chassis airflow, further improving system design flexibility. TE’s new Sliver jumper connector, optimized for OCP NIC 3.0, offers one of the highest performance-to-cost ratios available in the market.

Ann Ou, Product Manager at TE Connectivity, stated: "OCP designs are gaining momentum in the data center equipment industry. As a key supplier, TE provides connector solutions tailored for these designs. Our Sliver jumper connector delivers outstanding performance and high density in a standardized form factor, simplifying design and manufacturing for data center equipment partners."

Source: Electronic Enthusiast Network